We have a good idea of what we'll see on the outside, a similar smart phone design to the current iPhone 6S models, but what about the inside?
Apple is expected to include its latest A10 system-on-a-chip in the iPhone 7. On Wednesday, a leaked image of what looks to be three A10 chips packaged with silicon popped up on Weibo.
The Chinese microblogging site is notorious for images of leaked Apple parts and products. This specific image was posted by GeekBar, a Chinese repair shop.
The leaked images teach us that Apple may be going with the same 64-bit LPDDR4 interface just like the current A9 chip. MacRumors adds that the chips in the photo are likely in mid-production, as they appear to have the RAM layer stacked on top of the wafers instead of the processor.
