Apple Could Be Intending to Use Ultrasonic Bonding to Strengthen Next iPhone

[Maura]

International Business Times reports today on the possibility, based on a new patent find by Patently Apple, that Apple could be planning to use ultrasonic bonding on the next iPhone. According to Patently Apple, Apple filed a new patent application with the US Patent & Trademark Office on March 15 2012 that modifies a previous patent from 2008 involving using ultrasonic bonding on such devices as the 2009 metal-backed iPhone and the current iPod range. According to the report, ultrasonic bonding is able to forge a stronger, longer-lasting bond than that achieved by adhesives. Apparently Apple has used the technique previously, as mentioned, and the report says that aside from providing a more durable bond when used to fuse different parts of a device together, the result can also be more pleasing to the eye. Apparently there are some challenges involved with the use of ultrasonic bonding, however, in particular with materials that have different melting points, such as metal and plastic. Apple’s aim with this new patent is to try to eliminate these issues by using metallic material in its devices that is capable of withstanding the flow of melted plastic.


Source: iPhone 5 Release Rumors: Will ?Refined? Ultrasonic Bonding Make Apple?s Next iPhone Stronger? - International Business Times