- Joined
- Jul 27, 2011
- Messages
- 911
- Reaction score
- 328
The above image is an artist's concept render found randomly on the web.
Here's a spate of new iPhone 7 and iPhone 7 Plus rumors. First up is a continuation of previous intel suggesting the next-gen iPhone will finally include a waterproof design. The rumor elaborates by detailing the iPhone 7 will be made of “new compound materials” which are similar to a liquid metal design and will have water-resistant properties. This new material design will supposedly also hide the device antenna bands on the back of the phone and provide dust-resistance as well.
The new iPhones will supposedly include new hardware too. Rumors persist that Apple will choose to include USB Type-C connector, and a fingerprint sensor built into the display. There is further intel that Apple is at least testing wireless charging, multi Force Touch and dual-cameras.
That's not all in the new hardware department. Another rumor suggests that Apple has worked out a deal for the A10 chip to be built entirely by TSMC, and that the company will include 2GB of RAM in the iPhone 7, while the iPhone 7 Plus will have 3GB.
Finally, the last trickle of rumint from Apple-land hints at a September release for the next generation of iPhone flagships. This lines up with earlier rumors, so there could be some truth to it. Stay tuned for more details as they emerge!
Source: Yahoo
