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According to a report in The Korea Economic Daily, via MacRumors, LG Innotek is to begin mass production of flexible printed circuit boards (FPCB) in 2018 in a bid to become Apple’s main supplier for the 2018 iPhone 9.
The Korea Economic Daily’s sources say that LG Innotek has almost finished its first FPCB run, and is expected to start construction on its FPCB manufacturing facilities in the second half of 2017.
LG Innotek is said to be banking on becoming the premier FPCB component manufacturer for Apple and LG Electronics, an area where Samsung Electro-Mechanics currently has the monopoly, and is supplying the majority of FPCB components for the forthcoming iPhone 8, along with Inteflex.
FPCBs are now required by Apple with the advent of the forthcoming OLED iPhone 8, as the previous type of PCBs were not compatible with flexible OLED displays. In May the first rumours about the iPhone 9 materialised, stating that there will be two OLED phones in 2018, a 5.28-inch phone and a 6.46-inch phone.
Source: LG Innotek to Begin Mass Producing Flexible Printed Circuit Boards With Eye on 2018's 'iPhone 9'
