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​The need for a low cost iPhone which Apple can launch on emerging markets such as China, has been asserted and reasserted. Even so, not so many details have emerged about the purported upcoming device. This week, however, brings some insight into what specs the cheaper iPhone might pack under the hood.
The information was spotted by Macotakara, which reports via China Time. According to them, Apple is looking to use the services of the Taiwanese chipmaker TSMC in order to make the devices Snapdragon SoC. To produce the technology, TSMC will use the 28nm pr​​ocess. As known, Apple is looking to break further away in order to severe the partnership it has with its arch competitor, Samsung, in the chip sector.
Apple is rumored to keep the production of A-series silicon seen in the iPhone 4 and iPhone 4S still constant, while also producing its latest set of A6 chips which we see in the brand new iPhone 5 and in the latest generation tablets.
The rumor remains just what it is a rumor, until further clarification will arise in the matter, but it would be interesting to see Snapdragons, series 400 and 800, which include a cellular modem, Wi-Fi and Bluetooth added to Apple portfolio. And it makes sense if Apple would want to launch a cheaper version gadget to try to save component cost by using parts which feature multiple roles.
The report went on to say that Renesas Electronics will be in charge of producing LCD drivers while Toshiba, Elpida, Micron Technology, SK Hynix and SanDisk will provide the NAND flash memory.
Source: AppleInsider
