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9to5 Mac has been busy finding out about the various chips that will be inside the next iPhone when it was looking into the output from a debug examination of a prototype of the next iPhone. Among the many chips that 9to5 Mac says that it discovered is the Broadcom BCM4334, which has been seen in code dumps, and which 9to5 Mac says is a step up from the 65nm BCM4330 that is inside the newest iPad and the iPhone 4S. The new chip is built on a 40nm process, which 9to5 Mac says is smaller and more efficient. Apparently the Broadcom BCM4334 chip will enable Apple to make the next iPhone thinner, with a thinner battery, because of the way in which it saves power, with AnandTech writing that Broadcom said that it deliberately set about reducing the power of the BCM4334 by around 40-50% when compared to the BCM4330, and that, no doubt, was one of the reasons why Apple decided to put it in the next iPhone, especially as it will help to counter the effect of the increased power drain of new features such as the bigger screen and LTE radio.
Source: New iPhone to debut with Dual-Band 40nm BCM4334 Broadcom Wi-Fi, significant power savings and Wi-Fi Direct/iOS AirDrop | 9to5Mac | Apple Intelligence